Successful PCB design for RF/Wireless applications presents many challenges and is an art as much as it is science. The PCB design must capture the RF hardware design, achieve isolation of high frequency signals from power supply and communication lines, provide for correct “RF” ground, isolate components that may be susceptible to crosstalk from other components, achieve dense component placement, provide for test point access—doing so within the space constraints dictated by the client’s enclosure while simultaneously creating a design that offers high yield during manufacturing.